APRA
AP 2072 12W Black Deep Recessed COB Downlight
Formulate magnificent, high-contrast lighting arrangements with the pinpoint projection of this 12W Low-Depth Dark-Chassis Spotlight. Tailored specifically to stop distracting overhead glare and light scatter while clearing strict structural space limits, this premium downlight seats major mechanical capability inside an exceptionally modern, matte black flush-fit layout.
Technical Specifications
| Feature | Details |
| Wattage | 12 Watts |
| Operational Grid | AC 150–265V | 50/60Hz |
| Chassis Color | Deep Architectural Matte Black |
| Color Spectrum | 3000K (Warm White ) |
| Driver Configuration | Apra External Control Module |
| Color Rendering Index | 80 (True-to-Life Color Precision) |
| Illumination Tech | High-Flux Integrated Chip-on-Board (COB) |
| Wholesale Packaging | 20 Units / Master Box |
Dimensions & Build
| Measurement | Value |
| Outer Ring Diameter (O) | 83 mm |
| Ceiling Cut-out Width (C) | 70 mm (Installation Hole) |
| Total Height Depth (H) | 45 mm (Ultra-Low Profile) |
| Core Structure | Thermal-Grade Die-Cast Aluminum |
| Anchor Fitting | Heavy-Spring Recessed Ceiling Clips |
Care & Maintenance
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Chassis Polish & Handling: Cut power at the main electrical panels before attempting any inspection or physical adjustments. Clean the dark matte faceplate using exclusively a clean, dry lint-free cloth or static duster. To ensure the high-end black finish does not streak or weather, keep away from soap products, window cleaning fluids, or damp cloths.
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Overhead Framework Clearance: Ensure that your ceiling structure maintains an active internal void of at least 45mm to perfectly accept the low-profile cooling shell. Its slim structural footprint fits seamlessly into tight plasterboard channels or modern drop-panel grids.
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Plenum Thermal Protections: Do not bundle electrical lines, communication wires, or thermal blankets directly over or around the rear metal chassis. Open ambient airflow inside the roof gap is an absolute requirement to avoid running the chip-on-board driver modules too hot.
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